Three-Dimensional Integrated Circuit Design, Second Edition

Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman

  • 出版商: Morgan Kaufmann
  • 出版日期: 2017-07-03
  • 售價: $3,500
  • 貴賓價: 9.5$3,325
  • 語言: 英文
  • 頁數: 768
  • 裝訂: Paperback
  • ISBN: 0124105017
  • ISBN-13: 9780124105010
  • 立即出貨 (庫存=1)

買這商品的人也買了...

商品描述

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits.

Expanded with new chapters and updates throughout based on the latest research in 3-D integration:

  • Manufacturing techniques for 3-D ICs with TSVs
  • Electrical modeling and closed-form expressions of through silicon vias
  • Substrate noise coupling in heterogeneous 3-D ICs
  • Design of 3-D ICs with inductive links
  • Synchronization in 3-D ICs
  • Variation effects on 3-D ICs
  • Correlation of WID variations for intra-tier buffers and wires
  • Offers practical guidance on designing 3-D heterogeneous systems
  • Provides power delivery of 3-D ICs
  • Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more
  • Provides experimental case studies in power delivery, synchronization, and thermal characterization

商品描述(中文翻譯)

《三維積體電路設計,第二版》擴充了原書的內容,增加了兩倍以上的新內容,包括電路模型、溫度考慮、功耗管理、記憶體問題和異質整合的最新發展。3D IC 專家 Pavlidis、Savidis 和 Friedman 在整本書中涵蓋了完整的產品開發週期,強調不僅僅是物理設計,還包括算法和系統層面的考慮,以提高速度同時節省能源。這本書是一本方便的綜合參考書或實用設計指南,提供了針對三維積體電路設計中具體挑戰性問題的有效解決方案。

根據三維整合的最新研究,通過新增章節和全書的更新,擴充了以下內容:
- 使用 TSV 的三維 IC 製造技術
- 通過硅通孔的電氣建模和閉式表達式
- 異質三維 IC 中的基板噪聲耦合
- 具有感應鏈路的三維 IC 設計
- 三維 IC 中的同步
- 三維 IC 的變異效應
- 層內緩衝區和線路的 WID 變異相關性

本書還提供了關於設計三維異質系統的實用指南,包括:
- 三維 IC 的供電
- 展示了在包括各種材料、設備、處理器、GPU-CPU 整合等異質系統中使用三維 IC 的案例
- 提供了關於供電、同步和熱特性的實驗案例研究