High-Speed Photonics Interconnects (Hardcover)

Lukas Chrostowski, Krzysztof Iniewski

  • 出版商: CRC
  • 出版日期: 2013-04-05
  • 售價: $4,275
  • 貴賓價: 9.5$4,061
  • 語言: 英文
  • 頁數: 223
  • 裝訂: Hardcover
  • ISBN: 1466516038
  • ISBN-13: 9781466516038
  • 相關分類: 光電子學 Photonics
  • 立即出貨 (庫存 < 4)

商品描述

Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects.

From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers

Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology.

Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips

This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.

商品描述(中文翻譯)

處理能力的劇增迅速將芯片上的總帶寬擴展到Tb/s的範圍。這需要相應增加芯片之間的數據通信量,以不限制整體系統性能。為了滿足對芯片間通信帶寬的不斷增長需求,研究人員正在探索使用高速光學互連架構。與電氣互連相比,光學互連具有高帶寬和可忽略的頻率依賴性損耗,可以實現每通道超過10 Gb/s的數據傳輸速率。《高速光子互連》探討了一些基於光子互連的突破性技術和應用。

從高速I/O電路的演進到光子互連封裝和激光技術的最新進展,本書匯集了來自學術界和工業界專家的專業貢獻,將各個方面的高速光子互連的前沿研究集結在一卷之中。貢獻者們深入探討了從高速I/O電路的演進到光子互連封裝的各種技術。本書討論了與I/O數據傳輸速率擴展相關的挑戰和當前的設計技術。它還描述了主要的高速元件、通道特性和性能指標。本書讓讀者了解了光子互連技術所實現的眾多應用。

了解適用於與CMOS芯片高密度集成的光學互連技術

這本豐富插圖的著作詳細介紹了光學芯片間通信鏈路如何在適當的功耗效率水平下充分利用互補金屬氧化物半導體(CMOS)技術擴展的數據傳輸速率。本書將數學公式降到最低限度,為工程師、研究人員、研究生和企業家提供了高速光子互連動態領域的全面概述。