Altium Designer 24 PCB 設計官方教程 (高級實踐)
李崇偉 高夏英
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"本書系統論述了Altium Designer 24 軟件的高級功能及案例實踐（含紙質圖書、實踐案例、配套視頻教程），是一本進階學習高速PCB 設計的優秀工具書。全書分為8 章，第1 章為Altium Designer 24高級功能及應用，介紹PCB 設計流程中需要使用的高級功能；第2 章為設計規則的高級應用，介紹多層板中常見的規則、Query 語句的設置及應用、規則的導入和導出；第3 章為層疊應用及阻抗控制，介紹層疊添加和阻抗的計算等；第4 章為PCB 總體設計要求及規範，介紹PCB 常見設計規範、拼板、PCB 錶面處理工藝、組合裝配等；第5 章為EMC設計規範，包括EMC概述、常見EMC器件、佈局、布線等；第6～8 章為綜合實例，包含4 層STM32 開發板、4 層MT6261 智能手錶、6 層全志A64 平板電腦3 個完整案例。這些案例從PCB 設計的總體流程、創建工程文件、位號標註與封裝匹配、原理圖驗證與導入、板框繪制、電路模塊化設計、器件模塊化佈局、PCB的層疊設置、PCB布線、PCB 設計後期處理、生產文件的輸出、STM32 檢查表等步驟來演示整個設計過程。這些實例融入作者多年的高速PCB 設計經驗，能夠幫助讀者快速地掌握高速PCB 設計要點。本書可以作為高等院校相關專業的教材，也可以作為從事電子、電氣、自動化設計工作的工程師的參考用書。 "
目錄大綱
目錄
第 1 章 Altium Designer 24 高級功能及應用 ................................................................ 1
67 分鐘
1.1 原理圖高級功能...................................................................................................................1
1.1.1 層次式原理圖設計 ...................................................................................................1
1.1.2 原理圖多通道的應用..............................................................................................10
1.1.3 線束的設計及應用 .................................................................................................17
1.1.4 網絡表比對導入PCB.............................................................................................21
1.1.5 Reuse Blocks 的應用 ............................................................................................24
1.1.6 設計片段的使用.....................................................................................................27
1.1.7 器件頁面符的應用 .................................................................................................31
1.1.8 為原理圖符號鏈接幫助文檔...................................................................................32
1.1.9 元件符號庫報告的使用..........................................................................................34
1.1.10 裝配變量..............................................................................................................36
1.2 PCB 高級功能 ...................................................................................................................47
1.2.1 BGA 封裝的製作....................................................................................................47
1.2.2 BGA 的扇出方式....................................................................................................50
1.2.3 常見 BGA 規格的出線方式 ....................................................................................54
1.2.4 蛇形線的等長設計 .................................................................................................55
1.2.5 多個網絡的自動長度調整 ......................................................................................59
1.2.6 等長的拓撲結構.....................................................................................................61
1.2.7 xSignals 等長功能 .................................................................................................65
1.2.8 From to 等長功能...................................................................................................73
1.2.9 PCB 多板互連裝配設計 .........................................................................................74
1.2.10 ActiveBOM 管理..................................................................................................83
1.2.11 背鑽 Back Drill 的定義及應用..............................................................................94
1.2.12 FPGA 的引腳交換功能 ........................................................................................98
1.2.13 位號的反註解功能 .............................................................................................104
1.2.14 模塊復用的操作.................................................................................................107
1.2.15 PCB 佈局復制的使用.........................................................................................113
1.2.16 極坐標的應用 ....................................................................................................116
1.2.17 ActiveRoute 的應用...........................................................................................119
1.2.18 拼板陣列的使用.................................................................................................122
1.2.19 在 3D 模式下體現柔性板（Flex Board） ..........................................................127
1.2.20 盲埋孔的設置 ....................................................................................................134
1.2.21 Pad/Via 模板的使用...........................................................................................136
1.2.22 縫合孔的使用 ....................................................................................................139
1.2.23 MicroVia 的設置 ................................................................................................141
目錄
1.2.24 PCB 印刷電子的設置.........................................................................................143
1.2.25 元器件的推擠和交換功能 ..................................................................................147
1.2.26 PCB 機械層的無限制添加 .................................................................................148
1.3 PCB 後期文件輸出 ..........................................................................................................149
1.3.1 Output job 設計數據輸出 ....................................................................................149
1.3.2 Draftsman 的應用................................................................................................159
1.3.3 新的 Pick and Place 生成器 ................................................................................169
1.3.4 3D PDF 的輸出 ....................................................................................................171
1.3.5 製作 PCB 3D 視頻 ...............................................................................................172
1.3.6 導出鑽孔圖表的方法............................................................................................176
1.3.7 郵票孔的設置 ......................................................................................................177
1.3.8 Gerber 文件轉換成 PCB 文件 .............................................................................179
第 2 章 設計規則的高級應用 ........................................................................................ 182
52 分鐘
2.1 鋪銅連接方式 ..................................................................................................................182
2.2 間距規則..........................................................................................................................187
2.3 線寬規則..........................................................................................................................191
2.4 區域規則設置 ..................................................................................................................194
2.5 阻焊規則設置 ..................................................................................................................196
2.6 內電層的規則設置 ...........................................................................................................196
2.7 Return Path 的設置.........................................................................................................199
2.8 Query 語句的設置及應用 ................................................................................................201
2.9 規則的導入和導出 ...........................................................................................................210
第 3章 層疊應用及阻抗控制........................................................................................ 213
42 分鐘
3.1 層疊的添加及應用 ...........................................................................................................213
3.1.1 層疊的定義 ..........................................................................................................213
3.1.2 多層板的組成結構 ...............................................................................................214
3.1.3 層疊的基本原則...................................................................................................214
3.1.4 常見的層疊方案...................................................................................................215
3.1.5 正片和負片的概念 ...............................................................................................218
3.1.6 3W 原則/20H 原則 ...............................................................................................219
3.1.7 層疊的添加和編輯 ...............................................................................................219
3.1.8 平面的分割處理...................................................................................................222
3.1.9 平面多邊形 ..........................................................................................................224
3.2 阻抗控制..........................................................................................................................225
3.2.1 阻抗控制的定義及目的........................................................................................225
VIII 目錄
3.2.2 控制阻抗的方式...................................................................................................226
3.2.3 微帶線與帶狀線的概念........................................................................................227
3.2.4 阻抗計算的相關條件與原則.................................................................................227
3.2.5 Altium Designer 的材料庫 ...................................................................................227
3.2.6 阻抗計算實例 ......................................................................................................230
第 4 章 PCB 總體設計要求及規範 ................................................................................ 242
45 分鐘
4.1 PCB 常見設計規範 ..........................................................................................................242
4.1.1 過孔.....................................................................................................................242
4.1.2 封裝及焊盤設計規範............................................................................................244
4.1.3 走線.....................................................................................................................248
4.1.4 絲印.....................................................................................................................250
4.1.5 Mark 點................................................................................................................250
4.1.6 工藝邊 .................................................................................................................251
4.1.7 擋板條 .................................................................................................................252
4.1.8 屏蔽罩 .................................................................................................................252
4.2 拼板.................................................................................................................................253
4.2.1 V-Cut 的應用 .......................................................................................................254
4.2.2 郵票孔的應用 ......................................................................................................255
4.3 PCB 錶面處理工藝 ..........................................................................................................255
4.4 組裝.................................................................................................................................257
4.5 焊接.................................................................................................................................257
第 5 章 EMC 設計規範.................................................................................................. 259
26 分鐘
5.1 EMC 概述........................................................................................................................259
5.1.1 EMC 的定義.........................................................................................................259
5.1.2 EMC 有關的常見術語及其定義............................................................................259
5.1.3 EMC 研究的目的和意義 ......................................................................................261
5.1.4 EMC 的主要內容 .................................................................................................261
5.1.5 EMC 三要素.........................................................................................................261
5.1.6 EMC 設計對策 .....................................................................................................262
5.1.7 EMC 設計技巧 .....................................................................................................262
5.2 常見 EMC 器件................................................................................................................267
5.2.1 磁珠.....................................................................................................................267
5.2.2 共模電感..............................................................................................................268
5.2.3 瞬態抑制二極管...................................................................................................269
5.2.4 氣體放電管 ..........................................................................................................271
IX 目錄
5.2.5 半導體放電管 ......................................................................................................272
5.3 佈局.................................................................................................................................272
5.3.1 層的設置..............................................................................................................272
5.3.2 模塊劃分及特殊器件佈局 ....................................................................................274
5.3.3 濾波電路的設計原則............................................................................................276
5.3.4 接地時要註意的問題............................................................................................276
5.4 布線.................................................................................................................................277
5.4.1 布線優先次序 ......................................................................................................277
5.4.2 布線基本原則 ......................................................................................................277
5.4.3 布線層優化 ..........................................................................................................277
第 6 章 進階實例：4 層 STM32 開發板 ........................................................................ 279
58 分鐘
6.1 PCB 設計的總體流程 ......................................................................................................279
6.2 實例簡介..........................................................................................................................280
6.3 創建項目文件 ..................................................................................................................280
6.4 位號標註及封裝匹配 .......................................................................................................281
6.4.1 位號標註..............................................................................................................281
6.4.2 元件封裝匹配 ......................................................................................................282
6.5 項目驗證及導入...............................................................................................................283
6.5.1 項目驗證..............................................................................................................283
6.5.2 原理圖與 PCB 同步導入 ......................................................................................284
6.6 板框繪制..........................................................................................................................284
6.7 電路模塊化設計...............................................................................................................285
6.7.1 電源流向..............................................................................................................285
6.7.2 串口 RS232/RS485 模塊......................................................................................286
6.7.3 PHY芯片 DP83848 及網口 RJ45 設計 ................................................................286
6.7.4 OV2640/TFTLCD 的設計 .....................................................................................288
6.8 器件模塊化佈局...............................................................................................................288
6.9 PCB 層疊設置 .................................................................................................................289
6.10 PCB 布線 ......................................................................................................................291
6.10.1 創建 Class 及顏色顯示....................................................................................291
6.10.2 規則設置 .........................................................................................................293
6.10.3 布線規劃及連接...............................................................................................296
6.10.4 電源平面分割 ..................................................................................................296
6.10.5 走線優化 .........................................................................................................296
6.10.6 放置迴流地過孔...............................................................................................297
6.10.7 添加淚滴及整板鋪銅 .......................................................................................297
X 目錄
6.11 PCB 設計後期處理........................................................................................................299
6.11.1 DRC 檢查 ........................................................................................................299
6.11.2 器件位號及註釋的調整....................................................................................299
6.12 生產文件的輸出.............................................................................................................300
6.12.1 位號圖輸出......................................................................................................300
6.12.2 阻值圖輸出......................................................................................................305
6.12.3 Gerber 文件輸出 .............................................................................................306
6.12.4 生成 BOM........................................................................................................312
6.13 STM32 檢查表...............................................................................................................313
第 7 章 進階實例：4 層 MT6261 智能手錶................................................................... 315
77 分鐘
7.1 實例簡介..........................................................................................................................315
7.2 位號排列及添加封裝 .......................................................................................................315
7.2.1 位號排列..............................................................................................................315
7.2.2 封裝匹配..............................................................................................................317
7.3 項目驗證和查錯...............................................................................................................318
7.4 PCB 網表的導入..............................................................................................................318
7.5 PCB 板框的導入及定義...................................................................................................319
7.6 PCB 層疊設置 .................................................................................................................322
7.7 阻抗控制要求 ..................................................................................................................322
7.8 模塊化設計......................................................................................................................326
7.8.1 CPU核心.............................................................................................................326
7.8.2 PMU 模塊 ............................................................................................................326
7.8.3 Charger 模塊.......................................................................................................327
7.8.4 Wi-Fi MT5931 模塊..............................................................................................329
7.8.5 Speaker/Mic 模塊................................................................................................330
7.8.6 馬達模塊..............................................................................................................331
7.8.7 LCM 模塊 ............................................................................................................331
7.8.8 G-Sensor 模塊.....................................................................................................331
7.8.9 USB 接口電路......................................................................................................331
7.8.10 Flash 模塊 .........................................................................................................332
7.9 PCB 整板模塊化佈局 ......................................................................................................333
7.10 PCB 布線設計 ...............................................................................................................333
7.10.1 常見規則、Class、差分對的添加與設置.........................................................333
7.10.2 盲埋孔的設置及添加方法 ................................................................................335
7.10.3 BGA 扇孔處理.................................................................................................336
7.10.4 整體布線規劃及電源處理 ................................................................................336
XI 目錄
7.10.5 優化走線 .........................................................................................................336
7.11 PCB 的後期處理............................................................................................................337
7.11.1 鋪銅及修銅的處理...........................................................................................337
7.11.2 整板 DRC 檢查處理.........................................................................................338
7.11.3 絲印的調整......................................................................................................338
7.12 Output job 輸出生產文件...............................................................................................339
7.13 MT6261 智能手錶檢查表...............................................................................................343
第 8 章 進階實例：6 層全志 A64 平板電腦............................................................... 345
85 分鐘
8.1 實例簡介..........................................................................................................................345
8.2 板框及層疊設計...............................................................................................................347
8.2.1 板框導入及定義...................................................................................................347
8.2.2 層疊結構的確定...................................................................................................348
8.3 阻抗控制要求 ..................................................................................................................348
8.4 電路模塊分析 ..................................................................................................................351
8.4.1 LPDDR3 模塊 ......................................................................................................351
8.4.2 主控模塊..............................................................................................................353
8.4.3 PMIC模塊...........................................................................................................355
8.4.4 eMMC/NAND Flash 模塊.....................................................................................358
8.4.5 Audio 模塊...........................................................................................................359
8.4.6 USB 模塊.............................................................................................................361
8.4.7 Micro SD 模塊 .....................................................................................................361
8.4.8 Camera 模塊 .......................................................................................................362
8.4.9 液晶顯示模塊 ......................................................................................................362
8.4.10 CTP模塊...........................................................................................................363
8.4.11 Sensor 模塊.......................................................................................................364
8.4.12 HDMI 模塊.........................................................................................................364
8.4.13 Wi-Fi/BT 模塊.....................................................................................................365
8.5 器件佈局..........................................................................................................................366
8.6 規劃屏蔽罩區域...............................................................................................................367
8.7 布線設計..........................................................................................................................368
8.7.1 PCB 設計規則及添加 Class.................................................................................368
8.7.2 BGA 扇出 ............................................................................................................368
8.7.3 走線整體規劃及連接............................................................................................369
8.7.4 高速信號的等長處理............................................................................................369
8.7.5 大電源分割處理...................................................................................................370
8.7.6 走線改良..............................................................................................................371
XII 目錄
8.8 後期處理..........................................................................................................................372
8.8.1 鋪銅及挖空處理...................................................................................................372
8.8.2 DRC 檢查並修正..................................................................................................373
8.8.3 調整絲印..............................................................................................................374
8.9 生產文件的輸出...............................................................................................................374
8.10 A64 平板電腦檢查表..................................................................................................379
XIII
