芯片力量：全球半導體徵程與AI智造實錄

《芯片力量》的主要內容分成三個部分：第一篇（第 1 ～ 3 章）是機遇篇，闡述歷史機遇與產業歷程，包括半導體產業在過去一個世紀中帶給全球經濟發展的機遇，以及大國在半導體機遇中的競合與博弈歷程。第二篇（第 4 ～ 7 章）是技術篇，闡述交叉跨界技術創新，以及新一代信息技術在半導體產業正發揮的、愈發重要的作用，這涉及芯片設計、製造、封測，也包括芯片製造設備廠商的應用實踐與重要成果。第三篇（第 8、9 章）是管理篇，展望未來產業發展，包括如何看待和理解半導體產業在 21 世紀的爆發式增長，以及從產業發展管理及企業管理的視角出發，闡述如何更好地實現智能製造的升級管理。

目 錄

 

第1篇 機遇篇：半導體芯片全球進程與智造機遇

 

第1章 集成電路推動全球GDP增長與工業革命 ···············································2

1.1 集成電路推動全球GDP增長三十年與中國成就 ·······························2

1.1.1 半導體集成電路一直所處的戰略領地 ···················································2

1.1.2 俄羅斯集成電路產業現狀與未來電子戰 ··············································18

1.1.3 我國軟件與集成電路行業發展的三個十年 ···········································20

1.2 工業革命與不死摩爾定律 ··························································26

1.2.1 五次工業革命與半導體發展 ·····························································26

1.2.2 不死摩爾定律正從納米深入埃米 ·······················································34

1.2.3 投資成本增勢與產能預期 ································································38

 

第2章 美國科技製裁與中國自主替代 ······························································43

2.1 美國科技長臂管轄45年 ····························································43

2.2 美國白宮科技智囊與半導體軍工組織 ···········································46

2.2.1 政府：近90年白宮科技智囊及其盟國科技智囊 ···································46

2.2.2 軍工：DAPPA引領科研66年 ···························································51

2.3 憑使命改宿命、靠替代對製裁 ····················································56

2.3.1 國家科技咨詢委員會智囊團呼之欲出 ·················································56

2.3.2 政、經、金、產四位一體推動集成電路行業發展 ··································58

2.3.3 《中國製造2025》中的集成電路 ························································63

2.3.4 中國行業巨頭的跨界重塑 ································································67

 

第3章 集成電路與新信息技術交叉融合的智造機遇 ·········································73

3.1 智造工業軟件生逢其時 ·····························································73

3.1.1 製造強國必強於工業軟件 ································································73

3.1.2 工業軟件支撐起全球最強工業企業 ····················································77

3.1.3 智造工業軟件是半導體發展的黑武器 ·················································83

3.2 智能2—芯片與AI的交叉賦能 ·················································89

3.2.1 AI芯片引燃半導體產業爆發 ····························································89

3.2.2 AI是半導體智造的軟核心 ·······························································93

3.2.3 集成電路與AI的互促成就 ······························································97

3.3 AI應用於集成電路的投資回報分析 ···········································100

 

第2篇技術篇：集成電路與New IT的跨界融合與智造技術

 

第4章智造軟件持續加碼全球半導體製造 ·····················································106

4.1 開啟先進半導體智造之窗 ························································106

4.1.1 台灣的AI智造與競爭基礎：工業3.5 ················································106

4.1.2 從生產自動化邁向工程自動化 ·························································111

4.2 半導體智造軟件的極致力量 ·····················································114

4.2.1 半導體製造三大極致挑戰 ·······························································114

4.2.2 工業互聯數據匯聚的平臺化 ····························································122

4.2.3 數據科技在半導體製造中嶄露頭角 ···················································125

4.3 智能學習倉庫與數字孿生 ························································131

4.4 智造軟件提升芯片製造的KPI ··················································134

4.4.1 良率是晶圓生產的生命線與終極挑戰 ················································134

4.4.2 數據科技應用於製程良率管理 ·························································135

4.4.3 AI模糊神經網絡賦能良率預測與生產排程 ·········································139

 

第5章智造軟件為半導體產業提供全程價值 ·················································144

5.1 頭部半導體廠商對AI應用的洞察·············································144

5.1.1 英偉達 ·······················································································145

5.1.2 科磊 ··························································································146

5.1.3 泛林 ··························································································147

5.1.4 歐洲微電子研究中心 ·····································································148

5.1.5 邁康尼 ·······················································································150

5.2 半導體服務廠商的智造方案 ·····················································151

5.2.1 DataProphet的AI即服務方案 ··························································151

5.2.2 Onto Innovation的創新數據驅動解決方案··········································152

5.2.3 D2S的GPU加速方案 ···································································154

 

第6章 來自世界頭部半導體製造廠商的智造驗證 ··········································156

6.1 英特爾20年的AI智造之路 ·····················································158

6.1.1 AI在英特爾整廠應用的方法論 ························································158

6.1.2 優化AI應用排序以提升商業價值 ····················································159

6.1.3 英特爾實現AI智造的典型案例 ·······················································161

6.2 台積電11年的AI智造與大聯盟OIP··········································168

6.2.1 台積電的智造戰略 ········································································169

6.2.2 台積電的智造案例 ········································································178

6.2.3 台積電向客戶提供的虛擬晶圓廠 ······················································184

6.2.4 台積電大聯盟的開放式創新平臺 ······················································185

6.3 中芯國際的10年智造之路 ·······················································193

6.3.1 2011年打造雲端工廠的成果 ···························································194

6.3.2 2018年關於實施智能製造戰略的成果 ···············································196

6.3.3 2020年打造中芯國際工業互聯網平臺 ···············································198

6.4 其他知名半導體廠商的智造實踐 ···············································199

6.4.1 格芯 ··························································································199

6.4.2 美光 ·························································································200

 

第7章 來自世界頭部半導體設備廠商的智造驗證 ··········································202

7.1 阿斯麥是卓越的工業軟件公司 ··················································202

7.1.1 智控軟件是光刻三十年來的靈魂 ······················································203

7.1.2 阿斯麥擁有世界最大開放軟件社區 ···················································204

7.1.3 智能軟件應用場景及案例 ·······························································205

7.1.4 EUV光刻機與 F-35隱身戰機 ··························································207

7.2 應材的軟硬一體 ····································································209

7.2.1 AI賦能晶圓缺陷檢測 ····································································210

7.2.2 AI賦能晶圓製造產能爬坡及良率提升 ···············································211

7.2.3 AI賦能晶圓製造走向無人化“自動駕駛” ···········································213

7.2.4 應材的“全自動化半導體工廠”方案 ················································215

7.3 泛林的設備智能 ····································································217

7.3.1 泛林設備智能 ··············································································217

7.3.2 數字孿生/數字主線 ······································································217

7.3.3 虛擬工藝開發、智能工具與數字服務 ················································218

 

第3篇管理篇：未來科技與產業發展借鑒

 

第8章未來科技與半導體智造 ·······································································222

8.1 超級人類與未來科技······························································222

8.1.1 從“增長的極限”到“超級人類” ····················································222

8.1.2 中國“十四五”規劃的七大前沿科技 ················································228

8.1.3 歐美未來科技預測及策略 ·······························································233

8.2 半導體智造的遠景方略 ···························································235

8.2.1 半導體未來十年發展與挑戰 ····························································235

8.2.2 半導體智造方略 ···········································································237

8.2.3 面向未來的工業4.0晶圓工廠 ··························································241

8.2.4 5G在半導體領域的前瞻性應用 ························································244

 

第9章半導體產業展望及工業4.0創新 ·························································246

9.1 美國半導體行業組織管理借鑒 ··················································246

9.1.1 SIA推動美國半導體產業發展 ·························································246

9.1.2 SEMATECH推動美國半導體製造 ····················································247

9.2 半導體工業4.0轉型中的關鍵管理 ·············································250

9.2.1 數字化冠軍企業轉型的戰略定位 ······················································250

9.2.2 數字化冠軍企業轉型的變革管理 ······················································252

9.2.3 英特爾、台積電與三星的創新轉型案例 ·············································253

9.3 半導體產業工業4.0轉型的框架應用 ··········································262

9.3.1 TüV工業4.0成熟度模型九宮格 ······················································262

9.3.2 EDB工業智能成熟度指數 ······························································264

9.3.3 IMPLUS工業4.0成熟度自評 ··························································267

結語 ··················································································································270

致謝 ··················································································································272