Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

• Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
• Supplies state-of-the-art solutions for challenges unique to 3D circuit design
• Features contributions from renowned experts in their respective fields

Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

《3D集成電路的物理設計》揭示了如何有效且最佳地設計3D集成電路（IC）。同時，它還分析了3D技術的優勢，並利用這些優勢來設計3D電路的工具。

本書首先概述了傳統2D電路相關的物理設計挑戰，然後每一章節都深入探討了特定的物理設計主題。這本綜合性的參考書包括：

- 廣泛涵蓋2.5D/3D IC和單片3D IC的物理設計
- 提供針對3D電路設計獨特挑戰的最新解決方案
- 由各自領域的知名專家貢獻

《3D集成電路的物理設計》為追求2.5D/3D技術的人提供了一個方便的、尖端的資訊來源。

Aida Todri-Sanial holds a BS in electrical engineering from Bradley University, IL; an MS in electrical engineering from California State University, Long Beach, CA; and a PhD in electrical and computer engineering from the University of California, Santa Barbara. She has held visiting research positions at Cadence Design Systems, Mentor Graphics, IBM TJ Watson Research Center, and STMicroelectronics. She was a recipient of the John Bardeen Fellowship and an R&D engineer at Fermilab, IL. She is currently a research scientist at CNRS, France and a member of the Microelectronics Department at LIRMM, where she is the group leader of Integration and Design of Energy-Aware Circuits and Systems. Widely published, highly decorated, and an IEEE and ACM member, Dr. Todri-Sanial participates in several international conference committees and serves as an associate editor for IEEE TVLSI journal. She is also engaged with the EPWS and WiTEC.

Chuan Seng Tan holds a BEng in electrical engineering from the University of Malaya, Malaysia; an MEng in advanced materials from the National University of Singapore; and a PhD in electrical engineering from the Massachusetts Institute of Technology, Cambridge. He has been a research engineer with the Institute of Microelectronics, Singapore; an Applied Materials Graduate Fellow; and an intern at Intel Corporation, Oregon. He is currently an associate professor at Nanyang Technological University, Singapore, where he previously served as a Lee Kuan Yew Postdoctoral Fellow and an inaugural Nanyang Assistant Professor. Widely published, Dr. Tan participates in several international conference committees and is a member of the IEEE. He has edited three and co-authored two books, and serves as an associate editor for Elsevier Microelectronics Journal.

Aida Todri-Sanial擁有美國布拉德利大學電機工程學士學位、加州州立大學長灘分校電機工程碩士學位，以及加州聖塔芭芭拉大學電機與電腦工程博士學位。她曾在Cadence Design Systems、Mentor Graphics、IBM TJ Watson研究中心和STMicroelectronics擔任訪問研究職位。她曾獲得John Bardeen獎學金，並在伊利諾伊州費米實驗室擔任研發工程師。她目前是法國國家科學研究中心（CNRS）的研究科學家，並且是LIRMM微電子學系的一員，擔任能源感知電路和系統的整合和設計研究小組組長。Todri-Sanial博士在國際上發表了許多論文，並且是IEEE和ACM的成員，參與了多個國際會議委員會，並擔任IEEE TVLSI期刊的副編輯。她還參與了EPWS和WiTEC的工作。

Chuan Seng Tan擁有馬來亞大學電機工程學士學位、新加坡國立大學先進材料碩士學位，以及麻省理工學院電機工程博士學位。他曾在新加坡微電子研究所擔任研究工程師，並獲得Applied Materials研究生獎學金，還在英特爾公司俄勒岡州實習。他目前是新加坡南洋理工大學的副教授，曾擔任李光耀博士後研究員和南洋助理教授。Tan博士在國際上發表了許多論文，是IEEE的成員，並參與了多個國際會議委員會。他編輯了三本書並共同撰寫了兩本書，並擔任Elsevier微電子學期刊的副編輯。