Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei

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商品描述

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.

This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

商品描述(中文翻譯)

《高速印刷電路板和封裝的電磁兼容性建模與設計》介紹了與高速印刷電路板(PCB)和電子封裝相關的三個主要電磁兼容性(EMC)問題的電磁建模和設計:信號完整性(SI)、電源完整性(PI)和電磁干擾(EMI)。重點放在PCB和封裝的兩個基本被動元件上:電源分佈網絡和信號分佈網絡。本書分為兩部分。第一部分介紹了用於EMC建模的場-電路混合方法,包括模態方法、積分方程方法、柱狀波展開方法和去嵌入方法。第二部分介紹了EMC設計方法,並探討了新型超材料和二維材料在傳統EMC問題上的應用。

本書旨在加強實用工程師的有價值的電磁理論和數學方法,並培養具有先進EMC應用的學生。