Semiconductor Manufacturing Handbook, 2/e (Hardcover)
Hwaiyu Geng
- 出版商: McGraw-Hill Education
- 出版日期: 2017-09-20
- 售價: $4,130
- 貴賓價: 9.5 折 $3,924
- 語言: 英文
- 頁數: 560
- 裝訂: Hardcover
- ISBN: 125958769X
- ISBN-13: 9781259587696
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相關分類:
半導體
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其他版本:
Semiconductor Manufacturing Handbook 2e (Pb)
已絕版
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商品描述
Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information
Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities.
•Nanotechnology and microsystems manufacturing
•FinFET and nanoscale silicide formation
•Physical design for high-performance, low-power 3D circuits
•Epitaxi, anneals, RTP, and oxidation
•Microlithography, etching, and ion implantations
•Physical, chemical, electrochemical, and atomic layer vapor deposition
•Chemical mechanical planarization
•Atomic force metrology
•Packaging, bonding, and interconnects
•Flexible hybrid electronics
•Flat-panel,flexible display electronics, and photovoltaics
•Gas distribution systems
•Ultrapure water and filtration
•Process chemicals handling and abatement
•Chemical and slurry handling systems
•Yield management, CIM, and factory automation
•Manufacturing execution systems
•Advanced process control
•Airborne molecular contamination
•ESD controls in clean-room environments
•Vacuum systems and RF plasma systems
•IC manufacturing parts cleaning technology
•Vibration and noise design
•And much more
商品描述(中文翻譯)
經過全面修訂的半導體設計、製造和運營資訊的最新版本
由70位國際專家撰寫並由經驗豐富的技術顧問委員會審查,這本全面更新的資源清楚地解釋了在IC芯片、MEMS、傳感器和其他電子設備的設計和製造中使用的尖端工藝。第二版的《半導體製造手冊》涵蓋了使物聯網、工業物聯網、數據分析、人工智能、擴增實境和智能製造成為可能的新興技術。您將獲得有關半導體基礎知識、前端和後端工藝、納米技術、光伏、氣體和化學品、晶圓廠產量以及運營和設施的完整詳細信息。
- 納米技術和微系統製造
- FinFET和納米級矽化物形成
- 高性能、低功耗3D電路的物理設計
- 外延、退火、快速熱處理和氧化
- 微影術、蝕刻和離子注入
- 物理、化學、電化學和原子層氣相沉積
- 化學機械平坦化
- 原子力測量學
- 封裝、鍵合和互連
- 柔性混合電子學
- 平板、柔性顯示電子學和光伏
- 氣體分配系統
- 超純水和過濾
- 處理化學品處理和去除
- 化學和砂漿處理系統
- 產量管理、CIM和工廠自動化
- 製造執行系統
- 先進的過程控制
- 空氣中的分子污染
- 潔凈室環境中的ESD控制
- 真空系統和射頻等離子體系統
- IC製造部件清潔技術
- 振動和噪音設計
- 還有更多