Chip Multiprocessor Architecture: Techniques to Improve Throughput and Latency (Paperback)
暫譯: 晶片多處理器架構:提升吞吐量與延遲的技術 (平裝本)

Kunle Olukotun

  • 出版商: Morgan & Claypool
  • 出版日期: 2007-12-01
  • 售價: $1,620
  • 貴賓價: 9.5$1,539
  • 語言: 英文
  • 頁數: 154
  • 裝訂: Paperback
  • ISBN: 159829122X
  • ISBN-13: 9781598291223
  • 相關分類: 大數據 Big-data雲端運算
  • 海外代購書籍(需單獨結帳)

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商品描述

Chip multiprocessors - also called multi-core microprocessors or CMPs for short - are now the only way to build high-performance microprocessors, for a variety of reasons. Large uniprocessors are no longer scaling in performance, because it is only possible to extract a limited amount of parallelism from a typical instruction stream using conventional superscalar instruction issue techniques. In addition, one cannot simply ratchet up the clock speed on today's processors, or the power dissipation will become prohibitive in all but water-cooled systems. Compounding these problems is the simple fact that with the immense numbers of transistors available on today's microprocessor chips, it is too costly to design and debug ever-larger processors every year or two. CMPs avoid these problems by filling up a processor die with multiple, relatively simpler processor cores instead of just one huge core. The exact size of a CMPs cores can vary from very simple pipelines to moderately complex superscalar processors, but once a core has been selected the CMPs performance can easily scale across silicon process generations simply by stamping down more copies of the hard-to-design, high-speed processor core in each successive chip generation. In addition, parallel code execution, obtained by spreading multiple threads of execution across the various cores, can achieve significantly higher performance than would be possible using only a single core. While parallel threads are already common in many useful workloads, there are still important workloads that are hard to divide into parallel threads. The low inter-processor communication latency between the cores in a CMP helps make a much wider range of applications viable candidates for parallel execution than was possible with conventional, multi-chip multiprocessors; nevertheless, limited parallelism in key applications is the main factor limiting acceptance of CMPs in some types of systems.

商品描述(中文翻譯)

晶片多處理器(Chip multiprocessors,簡稱 CMP)現在是構建高效能微處理器的唯一方式,原因有很多。大型單處理器在性能上不再擴展,因為使用傳統的超標量指令發佈技術,從典型的指令流中提取的平行性是有限的。此外,今天的處理器無法簡單地提高時鐘速度,否則功耗將在除水冷系統外的所有系統中變得無法承受。這些問題的複雜性在於,隨著當今微處理器晶片上可用的晶體管數量龐大,每年或每兩年設計和調試越來越大的處理器的成本過高。CMP 通過在處理器晶片上填充多個相對簡單的處理器核心,而不是僅僅一個巨大的核心,來避免這些問題。CMP 核心的確切大小可以從非常簡單的管線到中等複雜的超標量處理器不等,但一旦選定核心,CMP 的性能可以通過在每一代晶片中印製更多難以設計的高效能處理器核心的副本,輕鬆地在矽製程世代之間擴展。此外,通過在各個核心之間分散多個執行緒來實現的平行代碼執行,可以達到顯著高於僅使用單一核心的性能。雖然平行執行緒在許多有用的工作負載中已經很常見,但仍然有一些重要的工作負載難以劃分為平行執行緒。CMP 中核心之間的低處理器間通信延遲使得比傳統的多晶片多處理器能夠支持更廣泛的應用成為平行執行的可行候選者;然而,關鍵應用中的有限平行性仍然是限制 CMP 在某些類型系統中接受度的主要因素。