買這商品的人也買了...
-
AMD, Intel, Arm 在戰什麼？一本書輕鬆看懂 CPU 原理$750$593
相關主題
商品描述
Recent Advance on Semiconductor Packaging.- System-in-Package.- Fan-In Wafer/Panel-Level Chip-Scale Packages.- Fan-Out Wafer/Panel-Level Packaging.- 2D, 2.1D, and 2.3D IC Integration.- 2.5D IC Integration.- 3D IC Integration.- Hybrid Bonding.- Chiplets Packaging.- Dielectric Materials.- Trends and Roadmap for Advanced Semiconductor Packaging.
商品描述(中文翻譯)
近期半導體封裝的進展。- 系統級封裝。- 晶圓/面板級晶片尺寸封裝。- 晶圓/面板級封裝。- 2D、2.1D 和 2.3D IC 整合。- 2.5D IC 整合。- 3D IC 整合。- 混合鍵合。- 晶片封裝。- 電介質材料。- 先進半導體封裝的趨勢和路線圖。
作者簡介
John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 41/2 years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign.With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.
He has received many awards from the American Society of Mechanical Engineers (ASME), the Institute of Electrical and Electronics Engineers (IEEE), the Society of Manufacturing Engineers (SME) and other societies. He is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME's, IEEE's, and IMAPS' technical activities.
作者簡介(中文翻譯)
John H. Lau, Ph.D., P.E.自2019年8月起擔任台灣統一磁材科技公司的首席技術官。在此之前，他在香港ASM Pacific Technology擔任高級技術顧問5年；在台灣工業技術研究院擔任專家4年半；在加利福尼亞州的惠普實驗室/安捷倫擔任高級科學家/MTS超過25年。他在伊利諾伊大學厄巴納-香檳分校獲得理論和應用力學博士學位。擁有超過40年的研發和製造經驗，他撰寫或合著了480多篇同行評審的技術論文，發明了30多項已獲得或待批准的美國專利，並在全球范圍內發表了300多場演講/研討會/主題演講。他撰寫或合著了20本關于扇出晶片級封裝、3D IC異質集成和封裝、3D集成的TSV、先進MEMS封裝、2D和3D IC互連可靠性、翻轉芯片、WLP、MCM、面陣封裝、WLCSP、高密度PCB、SMT、DCA、TAB、無鉛材料、焊接、製造和焊點可靠性的教科書。
他曾獲得美國機械工程師學會（ASME）、電氣和電子工程師學會（IEEE）、製造工程師學會（SME）和其他學會的多項獎項。他是ASME、IEEE和IMAPS的選舉會士，並積極參與了ASME、IEEE和IMAPS的許多技術活動。
