ESD Basics: From Semiconductor Manufacturing to Use (Hardcover)

Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips.

The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology.

Look inside for extensive coverage on:

• The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology
• Semiconductor manufacturing handling and auditing processing to avoid ESD failures
• ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests
• ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems
• System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications
• Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures

ESD Basics: From Semiconductor Manufacturing to Product Use complements the author’s series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.

靜電放電（ESD）持續影響著從微電子到納米電子的半導體製造、半導體元件和系統的技術。本書介紹了ESD、電氣過壓（EOS）、電磁干擾（EMI）、電磁兼容性（EMC）和閂住現象的基礎知識，並提供了半導體製造環境和最終系統組裝的一個連貫的概述。它深入探討了ESD保護網絡的整合，並提供了特定技術、電路和芯片的實例。

本書獨特之處在於涵蓋了半導體晶片製造問題、ESD半導體晶片設計以及當今和未來所面臨的系統問題，以及ESD現象和納米技術的未來。

內容詳細涵蓋了以下內容：

- 靜電學的基礎知識、摩擦帶電以及它們與從微電子到納米技術的現代製造環境的關聯
- 半導體製造處理的處理和審核，以避免ESD故障
- ESD、EOS、EMI、EMC和閂住半導體元件和系統級測試，以展示產品對人體模型（HBM）、傳輸線脈衝（TLP）、充電器件模型（CDM）、人體金屬模型（HMM）、電纜放電事件（CDE）以及系統級IEC 61000-4-2測試的耐久性
- ESD晶片設計和製程製造實踐和解決方案，以改善ESD半導體晶片解決方案，同時提供實用的離晶ESD保護和系統級解決方案，以提供更強大的系統
- 伺服器、筆記型電腦、硬碟驅動器、手機、數碼相機、手持設備、汽車和太空應用中的系統級問題
- 最先進技術的ESD設計示例，包括CMOS、BiCMOS、SOI、雙極技術、高壓CMOS（HVCMOS）、RF CMOS、智能電源、磁記錄技術、微機械（MEMs）到納米結構

《ESD Basics: From Semiconductor Manufacturing to Product Use》是作者關於ESD保護的系列書籍的補充。對於新手來說，它是一本必備的參考書，也是對現代技術所面臨的問題有用的洞察，因為我們進入納米電子時代。