Area Array Packaging Handbook: Manufacturing and Assembly
Ken Gilleo
- 出版商: McGraw-Hill Education
- 出版日期: 2001-11-05
- 售價: $4,360
- 貴賓價: 9.5 折 $4,142
- 語言: 英文
- 頁數: 1000
- 裝訂: Hardcover
- ISBN: 0071374930
- ISBN-13: 9780071374934
-
相關分類:
Assembly
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商品描述
AREA ARRAY PACKAGING AT THE CUTTING EDGE
The first book to bring BGA, CSP, and Flip Chip together--teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging.
Filled with hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook is an unbeatable resource for success in todays fast-paced world of HDI.
Look for these highlights inside:
*The hottest technologies in electronics packaging—BGA, CSP, and Flip Chip—all in one reference
*Details on MEMs technology
*Pros and cons of each technology in various applications
*Solutions for difficult packaging ramifications of HDI design concepts
*Detailed coverage of critical reliability and testing issues
*Help with design, materials, and manufacturing processes
*Problem-solving approaches to conception, construction, assembly, and applications
*World-class expert contributors
*400 illustrations
ADVANCES
APPLICATIONS
CONCEPTS
DESIGN
ECONOMICS
OPIMIZATION
EQUIPMENT
FUTURE TECHNOLOGY
MATERIALS
PROCESSES
PRODUCTIVITY
Forword
Section 1: Packaging Concepts and Design
Chapter 1: Introduction to Electronic Packaging
Chapter 2: Electronics Industry Overview
Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry
Chapter 4: Area Array Packaging
Chapter 5: Stacked/3D Packages
Chapter 6: Compliant IC Packaging
Chapter 7: Flip Chip Technology
Chapter 8: Options in High-Density Part Cleaning
Chapter 9: MEMS Packaging and Assembly Challenges
Chapter 10: Ceramic Ball and Column Grid Array Overview
Section 2: Materials
Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills
Chapter 12: Hermetic Packaging Systems: Adhesive and Getter
Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes
Chapter 14: Modern Solder and Solder Paste
Chapter 15: Lead-Free Systems and Process Implications
Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?
Section 3: Equipment and Processes
Chapter 17: Next-Generation Flip Chip Materials and Processes
Chapter 18: Flip Chip Assembly and Underfilling
Chapter 19: BGA and CSP Rework: What is Involved?
Chapter 20: BGA Assembly Reliability
Chapter 21: Die Attach and Rework
Chapter 22: Liquid Encapsulation Equipment and Processes
Chapter 23: Molding for Area Array Packages
Chapter 24: Screen Printing and Stenciling
Chapter 25: Criteria for Placement and Processing of Advanced Packages
Chapter 26: Ovens in Electronics
Chapter 27: Process Development, Control, and Organization
Section 4: Economics and Productivity
Chapter 28: Metrics: The Key to Productivity
Chapter 29: Cost Estimating for Electronic Assembly
Section 5: Future
Chapter 30: The Future of Electronic Packaging
Chapter 31: The Future of SMT Process Equipment
Index