Area Array Packaging Handbook: Manufacturing and Assembly
Ken Gilleo
- 出版商: McGraw-Hill Education
- 出版日期: 2001-11-05
- 售價: $4,440
- 貴賓價: 9.5 折 $4,218
- 語言: 英文
- 頁數: 1000
- 裝訂: Hardcover
- ISBN: 0071374930
- ISBN-13: 9780071374934
-
相關分類:
Assembly
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相關主題
商品描述
AREA ARRAY PACKAGING AT THE CUTTING EDGE
The first book to bring BGA, CSP, and Flip Chip together--teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging.
Filled with hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook is an unbeatable resource for success in todays fast-paced world of HDI.
Look for these highlights inside:
*The hottest technologies in electronics packaging—BGA, CSP, and Flip Chip—all in one reference
*Details on MEMs technology
*Pros and cons of each technology in various applications
*Solutions for difficult packaging ramifications of HDI design concepts
*Detailed coverage of critical reliability and testing issues
*Help with design, materials, and manufacturing processes
*Problem-solving approaches to conception, construction, assembly, and applications
*World-class expert contributors
*400 illustrations
ADVANCES
APPLICATIONS
CONCEPTS
DESIGN
ECONOMICS
OPIMIZATION
EQUIPMENT
FUTURE TECHNOLOGY
MATERIALS
PROCESSES
PRODUCTIVITY
Forword
Section 1: Packaging Concepts and Design
Chapter 1: Introduction to Electronic Packaging
Chapter 2: Electronics Industry Overview
Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry
Chapter 4: Area Array Packaging
Chapter 5: Stacked/3D Packages
Chapter 6: Compliant IC Packaging
Chapter 7: Flip Chip Technology
Chapter 8: Options in High-Density Part Cleaning
Chapter 9: MEMS Packaging and Assembly Challenges
Chapter 10: Ceramic Ball and Column Grid Array Overview
Section 2: Materials
Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills
Chapter 12: Hermetic Packaging Systems: Adhesive and Getter
Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes
Chapter 14: Modern Solder and Solder Paste
Chapter 15: Lead-Free Systems and Process Implications
Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?
Section 3: Equipment and Processes
Chapter 17: Next-Generation Flip Chip Materials and Processes
Chapter 18: Flip Chip Assembly and Underfilling
Chapter 19: BGA and CSP Rework: What is Involved?
Chapter 20: BGA Assembly Reliability
Chapter 21: Die Attach and Rework
Chapter 22: Liquid Encapsulation Equipment and Processes
Chapter 23: Molding for Area Array Packages
Chapter 24: Screen Printing and Stenciling
Chapter 25: Criteria for Placement and Processing of Advanced Packages
Chapter 26: Ovens in Electronics
Chapter 27: Process Development, Control, and Organization
Section 4: Economics and Productivity
Chapter 28: Metrics: The Key to Productivity
Chapter 29: Cost Estimating for Electronic Assembly
Section 5: Future
Chapter 30: The Future of Electronic Packaging
Chapter 31: The Future of SMT Process Equipment
Index
商品描述(中文翻譯)
區域陣列封裝的前沿
這是第一本將BGA、CSP和Flip Chip結合在一起的書籍,教授設計、應用和製造的實用技巧。隨著傳呼機、手機和其他便攜式電子產品的縮小,以及對功能和特性的需求不斷增長,對更好、更快、更小、更酷的高密度互連(HDI)的需求變得愈加迫切。《區域陣列封裝手冊》為您提供了在這一快速擴展的微電子封裝領域所需的詳細資訊。
本書充滿了工程師在日常決策中所需的實用、前沿資訊,是在當今快速變化的HDI世界中取得成功的無可匹敵的資源。
書中亮點包括:
* 電子封裝中最熱門的技術——BGA、CSP和Flip Chip——全在一本參考書中
* MEMs技術的詳細資訊
* 各種應用中每種技術的優缺點
* HDI設計概念的困難封裝問題的解決方案
* 關鍵可靠性和測試問題的詳細覆蓋
* 設計、材料和製造過程的幫助
* 概念、建造、組裝和應用的問題解決方法
* 世界級專家貢獻者
* 400幅插圖
進展
應用
概念
設計
經濟學
優化
設備
未來技術
材料
過程
生產力
目錄
前言
第一部分:封裝概念與設計
第1章:電子封裝簡介
第2章:電子產業概述
第3章:電子製造業的趨勢/驅動因素
第4章:區域陣列封裝
第5章:堆疊/3D封裝
第6章:柔性IC封裝
第7章:Flip Chip技術
第8章:高密度元件清潔的選項
第9章:MEMS封裝與組裝挑戰
第10章:陶瓷球和柱狀網格陣列概述
第二部分:材料
第11章:聚合物封裝材料:膠水、封裝材料和底填料
第12章:密封封裝系統:膠水和吸氣劑
第13章:區域陣列焊球、焊膏和助焊劑
第14章:現代焊料和焊膏
第15章:無鉛系統及其過程影響
第16章:用於表面貼裝和Flip Chip過程的導電膠:焊料的替代品?
第三部分:設備與過程
第17章:下一代Flip Chip材料與過程
第18章:Flip Chip組裝與底填
第19章:BGA和CSP的返工:涉及哪些內容?
第20章:BGA組裝的可靠性
第21章:晶片附著與返工
第22章:液體封裝設備與過程
第23章:區域陣列封裝的模具
第24章:絲網印刷與模板印刷
第25章:先進封裝的放置與處理標準