Electronic Materials and Processes Handbook, 3/e

Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications.

This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.

Contents ：           

   Chapter 1: Development and Fabrication of IC Chips
   Chapter 2: Plastics, Elastomers, and Composites
   Chapter 3: Ceramics and Glasses
   Chapter 4: Metals
   Chapter 5: Solder Technologies for Electronic Packaging and Assembly
   Chapter 6: Electroplating and Deposited Metallic Coatings
   Chapter 7: Printed Circuit Board Fabrication
   Chapter 8: Materials and Processes for Hybrid Microelectronics and Multichip Modules
   Chapter 9: Adhestives Underfills, and Coatings in Electronics Assemblies
   Chapter 10: Thermal Management Materials and Systems
    Index