Microchip Fabrication: A Practical Guide to Semiconductor Processing, 6/e (Hardcover)
暫譯: 微晶片製造:半導體加工實用指南,第6版(精裝本)

Peter Van Zant

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商品描述

The most complete, current guide to semiconductor processing

Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

COVERAGE INCLUDES:

  • The semiconductor industry
  • Properties of semiconductor materials and chemicals
  • Crystal growth and silicon wafer preparation
  • Wafer fabrication and packaging
  • Contamination control
  • Productivity and process yields
  • Oxidation
  • The ten-step patterning process--surface preparation to exposure; developing to final inspection
  • Next generation lithography
  • Doping
  • Layer deposition
  • Metallization
  • Process and device evaluation
  • The business of wafer fabrication
  • Devices and integrated circuit formation
  • Integrated circuits
  • Packaging

 

商品描述(中文翻譯)

最完整、最新的半導體製程指南

《微晶片製造》第六版經過全面修訂,以涵蓋該領域的最新進展,解釋了半導體製程的每個階段,從原材料準備到測試,再到包裝和運送成品。這本實用資源提供了易於理解的資訊,涵蓋了現代半導體複雜製造材料和過程背後的物理、化學和電子基本原理。

本新版本討論了在圖案化、摻雜和層疊步驟中使用的最先進的工藝和尖端技術。書中充滿了詳細的插圖和實際案例,這是對高科技產業技術基礎的全面、最新的介紹。

涵蓋內容包括:

- 半導體產業
- 半導體材料和化學品的特性
- 晶體生長和矽晶圓準備
- 晶圓製造和包裝
- 汙染控制
- 生產力和過程產量
- 氧化
- 十步圖案化過程——表面準備到曝光;顯影到最終檢查
- 下一代光刻技術
- 摻雜
- 層沉積
- 金屬化
- 過程和裝置評估
- 晶圓製造的商業
- 裝置和集成電路形成
- 集成電路
- 包裝