Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
暫譯: 避免集成電路裝置焊點互連中的非彈性應變
Suhir, Ephraim
- 出版商: CRC
- 出版日期: 2024-10-04
- 售價: $2,670
- 貴賓價: 9.5 折 $2,537
- 語言: 英文
- 頁數: 382
- 裝訂: Quality Paper - also called trade paper
- ISBN: 0367635887
- ISBN-13: 9780367635886
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商品描述
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
商品描述(中文翻譯)
本書探討了分析（數學）建模方法，旨在理解IC設備中焊料材料及焊接接點的行為和性能背後的物理和力學原理。重點在於可靠性設計，包括對焊料壽命的概率預測。
