Transaction-Level Modeling with Systemc: Tlm Concepts and Applications for Embedded Systems

Frank Ghenassia

Transaction-Level Modeling with Systemc: Tlm Concepts and Applications for Embedded Systems
  • 出版商: Springer
  • 出版日期: 2005-11-28
  • 售價: $7,950
  • 貴賓價: 9.5 折 $7,553
  • 語言: 英文
  • 頁數: 272
  • 裝訂: Hardcover
  • ISBN: 0387262326
  • ISBN-13: 9780387262321
  • 相關分類: 嵌入式系統

    • 海外代購書籍(需單獨結帳)

買這商品的人也買了...

相關主題

商品描述

Description

Currently employed at STMicroelectronics, Transactional-Level Modeling (TLM) puts forward a novel SoC design methodology beyond RTL with measured improvements of productivity and first time silicon success.

The SystemC consortium has published the official TLM development kit in May 2005 to standardize this modeling technique. The library is flexible enough to model components and systems at many different levels of abstractions: from cycle-accurate to untimed models, and from bit-true behavior to floating-point algorithms. However, careful selection of the abstraction level and associated methodology is crucial to ensure practical gains for design teams.

Transaction-Level Modeling with SystemC presents the formalized abstraction and related methodology defined at STMicroelectronics, and covers all major topics related to the Electronic System-Level (ESL) industry:

- TLM modeling concepts
- Early embedded software development based on SoC virtual prototypes
- Functional verification using reference models
- Architecture analysis with mixed TLM and cycle accurate platforms
- Unifying TLM and RTL with platform automation tools

Complementary to the book, open source code to put this approach into practice is available on several Internet sites as indicated in the first chapter.

 

Table of contents

Foreword
Author: P Magarshack

Chapter 1: TLM: An Overview and Brief History
Authors: F.Ghenassia and A.Clouard

Chapter 2: Transaction Level Modeling – An Abstraction beyond RTL
Authors: L.Maillet-Contoz and F.Ghenassia

Chapter 3: TLM Modeling Techniques based on SystemC
Authors: L.Maillet-Contoz and J.-P.Strassen

Chapter 4: Embedded Software Development through the TLM Approach
Authors: E.Paire

Chapter 5: Functional Verification From the TLM Perspective
Authors: T.Bultiaux, S.Guenot, S.Hustin, A.Blampey, J.Bulone and M.Moy

Chapter 6: Architecture Analysis and System Debugging - a Transactional Debugging
Authors: A. Perrin and G.Poivre

Chapter 7: Design Automation - Integrating TLM in SoC Design Flow
Authors: C.Amerijckx, S.Guenot, A.Kerkeni and S.Hustin


 

商品描述(中文翻譯)

描述



目前在STMicroelectronics工作，事務層級建模（TLM）提出了一種新的SoC設計方法論，超越了RTL，並在生產力和首次硅成功方面取得了實測改進。



SystemC聯盟於2005年5月發布了官方的TLM開發套件，以標準化這種建模技術。該庫足夠靈活，可以在多個不同的抽象層次上對組件和系統進行建模：從週期準確到無時序模型，從位真實行為到浮點算法。然而，仔細選擇抽象層次和相關方法論對於確保設計團隊的實際收益至關重要。



使用SystemC的事務層級建模介紹了STMicroelectronics定義的正式抽象和相關方法論，並涵蓋了與電子系統級（ESL）行業相關的所有主要主題：


- TLM建模概念
- 基於SoC虛擬原型的早期嵌入式軟件開發
- 使用參考模型進行功能驗證
- 使用混合TLM和週期準確平台進行架構分析
- 使用平台自動化工具統一TLM和RTL


除書籍外，將此方法付諸實踐的開源代碼可在第一章中指定的多個網站上獲得。


 



目錄



前言
作者： P
Magarshack


第1章：TLM：概述和簡史
作者： F.Ghenassia和
A.Clouard


第2章：事務層級建模-超越RTL的抽象
作者： L.Maillet-Contoz和 F.Ghenassia


第3章：基於SystemC的TLM建模技術
作者： L.Maillet-Contoz和 J.-P.Strassen


第4章：通過TLM方法進行嵌入式軟件開發
作者： E.Paire


第5章：從TLM角度進行功能驗證
作者： T.Bultiaux, S.Guenot, S.Hustin, A.Blampey, J.Bulone和 M.Moy


第6章：架構分析和系統調試-事務性調試
作者： A. Perrin和 G.Poivre


第7章：設計自動化-將TLM集成到SoC設計流程中
作者： C.Amerijckx, S.Guenot, A.Kerkeni和 S.Hustin



 


類似商品