Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing (Hardcover)

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.  

• Models and simulates numerous processes in manufacturing, reliability and testing for the first time
• Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing
• Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products
• Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects
• Appendix and color images available for download from the book's companion website

Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.

Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

儘管在集成電路封裝設計階段越來越需要建模和模擬，但大多數組裝過程和各種可靠性測試仍然基於耗時的“測試和嘗試”方法來獲得最佳解決方案。建模和模擬可以輕鬆確保虛擬實驗設計（DoE）以達到最佳解決方案。這大大降低了成本和生產時間，尤其是對於新產品開發而言。在未來的3D封裝發展中，使用建模和模擬將變得越來越必要。在這本書中，Liu和Liu讓該領域的人們學習基本和高級的建模和模擬技能，以幫助解決他們遇到的問題。

• 首次對製造、可靠性和測試進行了大量的建模和模擬
  


• 提供了虛擬原型和虛擬可靠性驗證和測試所需的技能
  


• 演示了先進的微電子產品工程設計的同步工程和共同設計方法
  


• 涵蓋了典型的IC、光電子學、MEMS、2D/3D SiP和納米互連的封裝和組裝
  


• 附錄和彩色圖片可從該書的附屬網站下載
  

Liu和Liu將這本書優化給微電子封裝和互連設計、組裝製造、電子可靠性/質量和半導體材料的實踐工程師、研究人員和研究生使用。產品經理、應用工程師、銷售和市場人員，需要向客戶解釋組裝製造、可靠性和測試對其產品的影響，也會發現這本書是一個重要的資源。

附錄和選定圖片的彩色版本可在www.wiley.com/go/liu/packaging找到。