Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Ning-Cheng Lee PhD

  • 出版商: Newnes
  • 出版日期: 2002-01-11
  • 售價: $4,580
  • 貴賓價: 9.5$4,351
  • 語言: 英文
  • 頁數: 288
  • 裝訂: Hardcover
  • ISBN: 0750672188
  • ISBN-13: 9780750672184
  • 已絕版

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商品描述

Description

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

 

Table of Contents

Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index

商品描述(中文翻譯)

描述

本書專注於電子封裝和生產領域的技術創新,闡明了回流焊接過程中的變化、其對缺陷機制的影響,以及在各種電路板類型中這些過程的故障排除技術。針對電子製造過程工程師、設計工程師以及過程工程課程的學生,《回流焊接過程與故障排除》將成為製造人員持續技能發展市場中的強有力競爭者。本書採用非常實用的實作方式撰寫,提供工程師增進對焊接、助焊劑和焊料膏技術原理理解的手段。作者促進了對其他重要主題的學習,例如區域陣列封裝——包括BGA、CSP和FC設計、焊球技術、組裝和返工過程——並增進了對焊接的SMT元件可靠性失效模式的理解。本書以成本效益為首要考量,旨在在電路板進入製造過程之前排除錯誤或問題,從而節省前期的時間和金錢。作者的豐富專業知識和經驗確保了主題的深入研究、撰寫和組織,以最佳方式滿足製造過程工程師、學生、實務工作者以及任何希望深入了解回流焊接過程的人的需求。本書內容全面且不可或缺,將成為讀者無價的培訓和參考工具。

目錄

表面貼裝電子封裝技術介紹;焊料和焊接的基本原理(包括焊接理論、元素成分對濕潤的影響、相圖與焊接、微觀結構與焊接、雜質對焊接的影響);焊料膏技術(包括助焊劑反應、助焊劑化學、焊料粉、焊料膏成分與製造、焊料膏流變學);表面貼裝組裝過程(包括焊料膏材料、印刷機水平考量、回流氣氛對焊接的影響、焊點檢查、電路測試);回流前的SMT問題(包括助焊劑分離、結殼、膏料硬化、模板壽命差、印刷厚度差、刮刀懸掛、下垂、印刷質量差、針頭堵塞、低黏性);回流過程中的SMT問題;回流後的SMT問題;BGA和CSP焊球技術;BGA、CSP和翻轉晶片焊球技術;BGA和CSP電路板級組裝(包括組裝階段發生的問題和返工);BGA和CSP返工;翻轉晶片回流焊接;通過缺陷機制分析優化回流曲線;無鉛焊接的焊料膏和助焊劑技術趨勢;如何選擇焊料膏或助焊劑;結論;附錄;參考文獻;索引。