Mixed-Signal Layout Generation Concepts (Hardcover)

Chieh Lin, Arthur H.M. van Roermund, Domine Leenaerts

  • 出版商: Springer
  • 出版日期: 2003-10-31
  • 售價: $1,600
  • 貴賓價: 9.8$1,568
  • 語言: 英文
  • 頁數: 210
  • 裝訂: Hardcover
  • ISBN: 1402075987
  • ISBN-13: 9781402075988
  • 下單後立即進貨 (約5~7天)

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Description

Mixed-Signal Layout Generation Concepts covers important physical-design issues that exist in contemporary analog and mixed-signal design flows. Due to the increasing pressure on time-to-market, the steep increase in chip fabrication costs, and the increasing design complexity, it becomes even more challenging to produce a first-time right IC layout. The fundamental issues in creating a layout are placement and routing. Although these coupled problems have been investigated for many decades, no satisfactory automated solution has emerged yet. Fortunately, supported by modern computing power and results of new research that further improve computation efficiency, significant steps forward have been taken.
Mixed-Signal Layout Generation Concepts brings together many principles and techniques required to successfully develop and implement layout generation tools to accommodate many mixed-signal layout generation needs. Not only does it provide a comprehensive overview of state-of-the-art concepts, it also illustrates many concepts with intuitive examples and pseudo code. Altogether, it facilitates creation of insight in a vast and complex area.
For those who are new to the area of mixed-signal layout generation, this book provides an excellent introduction to advanced topics in this area. A practicing EDA researcher or tool developer might find this book a useful reference that combines classical and new principles. In addition, this book relates theories to each other and to pragmatic implementations. Finally, the designer, or layout artist, interested to have a thorough understanding of fundamental concepts in mixed-signal layout generation, can take advantage of the self-contained chapters in this book.
Table of contents

Preface. List of Abbreviations.
1: Introduction. 1.1. Outline of the Book.
2: Mapping Problems in the Design Flow. 2.1. Top-Down Flow and Bottom-Up Approach. 2.2. The Mapping Problem. 2.3. Placement and Routing Constraints.
3: Optimization Methods. 3.1. VLSI Optimization Methods. 3.2. Simulated Annealing. 3.3. Concluding Remarks.
4: Optimization Approach Based on Simulated Annealing. 4.1. Optimization Flow. 4.2. Problem Representation. 4.3. Perturbation Operators. 4.4. Acceptance and Generation Functions. 4.5. Temperature Schedule. 4.6. Stop Criterion. 4.7. Cost Function. 4.8. Concluding Remarks.
5: Efficient Algorithms and Data Structures. 5.1. Computational Model. 5.2. Asymptotic Analysis. 5.3. Computational Complexity. 5.4. Data Structures for CAD. 5.5. Concluding Remarks.
6: Placement. 6.1. Previous Work. 6.2. Effective and Efficient Placement. 6.3. Representation Generality, Flexibility and Sensitivity. 6.4. Sequence Pair Representation. 6.5. Graph-Based Packing Computation. 6.6.Non-Graph-Based Packing Computation. 6.7. Graph-Based Incremental Placement Computation. 6.8. Implementation Considerations. 6.9. Experimental Results. 6.10. Placement-to-Sequence-Pair Mapping. 6.11.Constrained Block Placement. 6.12. Concluding Remarks. 7: Routing. 7.1. The Routing Problem. 7.2. Classification of Routing Approaches. 7.3. Previous Work. 7.4. Computational Complexity. 7.5. Global Routing Model. 7.6. Global Routing Algorithms. 7.7. Benchmarking of Heuristics in Our Routing Model. 7.8. Incremental Routing. 7.9. Impact of Routing on Placement Quality. 7.10. Concluding Remarks.
8: Dealing with Physical Phenomena: Parasitics, Crosstalk and Process Variations. 8.1. Previous Work. 8.3. Self-Parasitics. 8.4. Crosstalk. 8.5. Process Variations. 8.6. Incorporating Crosstalk and Parasitics into Routing. 8.7. Incorporating Substrate Coupling into Placement. 8.8. Incremental Substrate Coupling Impact Minimization. 8.9. Concluding Remarks.
9: Conclusions. Bibliography. About the Authors. Index.

商品描述(中文翻譯)

描述

《混合信號佈局生成概念》涵蓋了當代類比和混合信號設計流程中存在的重要物理設計問題。由於市場推出時間的壓力日益增加、晶片製造成本的急劇上升以及設計複雜性的增加,首次正確生成IC佈局變得更加具有挑戰性。創建佈局的基本問題是放置和路由。儘管這些相互關聯的問題已經研究了數十年,但至今尚未出現令人滿意的自動化解決方案。幸運的是,在現代計算能力的支持下,以及新研究成果進一步提高計算效率,已經取得了顯著的進展。

《混合信號佈局生成概念》匯集了成功開發和實施佈局生成工具所需的許多原則和技術,以滿足多種混合信號佈局生成需求。它不僅提供了最先進概念的全面概述,還用直觀的例子和偽代碼說明了許多概念。總體而言,它促進了對一個廣泛而複雜領域的深入理解。

對於那些對混合信號佈局生成領域不熟悉的人來說,本書提供了該領域高級主題的優秀介紹。從事EDA研究或工具開發的實踐者可能會發現本書是一個有用的參考,結合了經典和新原則。此外,本書將理論彼此關聯,並與實用實現相結合。最後,對於希望深入理解混合信號佈局生成基本概念的設計師或佈局藝術家,可以利用本書中獨立的章節。

目錄

前言。縮寫列表。
1: 介紹。1.1. 本書大綱。
2: 設計流程中的映射問題。2.1. 自上而下的流程和自下而上的方法。2.2. 映射問題。2.3. 放置和路由約束。
3: 優化方法。3.1. VLSI優化方法。3.2. 模擬退火。3.3. 總結。
4: 基於模擬退火的優化方法。4.1. 優化流程。4.2. 問題表示。4.3. 擾動運算子。4.4. 接受和生成函數。4.5. 溫度計劃。4.6. 停止準則。4.7. 成本函數。4.8. 總結。
5: 高效算法和數據結構。5.1. 計算模型。5.2. 漸進分析。5.3. 計算複雜性。5.4. CAD的數據結構。5.5. 總結。
6: 放置。6.1. 先前的工作。6.2. 有效且高效的放置。6.3. 表示的一般性、靈活性和敏感性。6.4. 序列