Antenna-In-Package Technology and Applications
暫譯: 封裝內天線技術與應用

Liu, Duixian, Zhang, Yueping

Antenna-In-Package Technology and Applications
  • 出版商: Wiley
  • 出版日期: 2020-03-31
  • 定價: $4,650
  • 售價: 9.5 折 $4,418
  • 語言: 英文
  • 頁數: 416
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1119556635
  • ISBN-13: 9781119556633
  • 相關分類: 3D 列印、天線相關 Antennas、高普特考

    • 立即出貨 (庫存=1)

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商品描述

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging

Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors--well-known experts on the topic--explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP.

The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:

- Includes a brief history of antenna-in-package technology
- Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)
- Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance

Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

商品描述(中文翻譯)

天線設計、製造流程、天線整合及封裝的綜合指南

封裝內天線技術與應用介紹了AiP技術的歷史。它探討了天線與封裝、熱分析與設計，以及AiP技術的測量設置和方法。作者是該領域的知名專家，解釋了為什麼微帶貼片天線是最受歡迎的，並描述了封裝的各種限制，例如電性能、熱機械可靠性、緊湊性、可製造性和成本。本書還包括有關如何根據JEDEC規範選擇互連，以便於自動組裝的資訊，並描述了低溫共燒陶瓷、高密度互連、基於扇出晶圓級封裝的AiP，以及基於3D列印的AiP。

本書詳細討論了基於表面層流電路的大規模毫米波相控陣列的AiP設計，適用於94-GHz成像儀和28-GHz 5G新無線電。此外，本書還包括有關用於感測器節點、近場無線電力傳輸和物聯網應用的3D AiP的資訊。這本重要的書籍：

- 包含了封裝內天線技術的簡要歷史
- 描述了在AiP中廣泛使用的封裝結構，如球網陣列（BGA）和四方扁平無引腳（QFN）
- 探討了概念、材料和流程、設計及驗證，特別考慮到優秀的電性能、機械性能和熱性能

本書是為電機工程的學生、教授、研究人員和射頻工程師撰寫的，封裝內天線技術與應用提供了天線和封裝的材料選擇指南、天線設計與製造流程及封裝限制、天線整合和封裝的相關資訊。

作者簡介

DUIXIAN LIU, PHD, is a researcher and master inventorat IBM at Thomas J. Watson Research Center. He is a co-editor of the Wiley title Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits and Springer title Handbook of Antenna Technologies. He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation for nine years and a Guest Editor for the IEEE Transactions on Antennas and Propagation onfour Special Issues related to mm-wave antenna designs. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.

YUEPING ZHANG, PhD, is a Professor of Electronic Engineering at Nanyang Technological University and a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S). He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.

作者簡介(中文翻譯)

劉對賢博士是IBM Thomas J. Watson研究中心的研究員和首席發明家。他是Wiley出版的先進毫米波技術：天線、封裝與電路和Springer出版的天線技術手冊的共同編輯。他曾擔任IEEE天線與傳播學報的副編輯九年，並擔任IEEE天線與傳播學報四個與毫米波天線設計相關的特刊的客座編輯。他於2012年獲得了享有盛譽的IEEE AP-S Sergei A. Schelkunoff獎論文獎。他是IEEE的會士。

張月平博士是南洋理工大學電子工程系的教授，也是IEEE天線與傳播學會（IEEE AP-S）的傑出講師。他曾擔任IEEE天線與傳播學報的副編輯。他於2012年獲得了享有盛譽的IEEE AP-S Sergei A. Schelkunoff獎論文獎。他是IEEE的會士。

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