Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Hardcover)
暫譯: 先進應用領域的嵌入式與扇出晶圓及面板級封裝技術：高效能計算與系統封裝 (精裝版)

Kröhnert, Steffen, Keser, Beth

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Hardcover)
  • 出版商: Wiley
  • 出版日期: 2021-12-29
  • 售價: $1,750
  • 貴賓價: 9.8 折 $1,715
  • 語言: 英文
  • 頁數: 320
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1119793777
  • ISBN-13: 9781119793779
  • 相關分類: 嵌入式系統

    • 立即出貨 (庫存=1)

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商品描述

This book provides an in-depth understanding of the various fan-out and embedded die approaches given by authors offering differing perspectives. It begins by benchmarking the latest application space, then moves on to a market forecast that attempts to reverse engineer the products that will be available. The book also provides an analysis of the IP landscape and cost comparison of new and existing technologies. It then describes solutions developed and offered by Semiconductor IDM companies driving new package types for advanced application space (e.g. Intel, NXP, Samsung). The book addresses the semiconductor needs of various foundries and manufacturers, and concludes by exploring cutting edge research ongoing at institutes and consortiums.

商品描述(中文翻譯)

本書深入探討了不同作者所提供的各種扇出（fan-out）和嵌入式晶片（embedded die）方法，並提供不同的觀點。書中首先對最新的應用領域進行基準測試，接著進行市場預測，試圖逆向工程未來可用的產品。該書還分析了知識產權（IP）環境以及新舊技術的成本比較。接下來，書中描述了由半導體 IDM 公司（如 Intel、NXP、Samsung）開發並提供的解決方案，這些解決方案推動了針對先進應用領域的新封裝類型。書中針對各種晶圓廠和製造商的半導體需求進行了探討，最後探討了各研究機構和聯盟正在進行的前沿研究。

作者簡介

Beth Keser, PhD, is an IEEE Fellow and Distinguished Lecturer with over 23 years' experience in the semiconductor industry and a co-Editor of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Beth's excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 30 patents and patents pending and over 50 publications in the semiconductor industry.

Steffen Kröhnert is President & Founder of ESPAT-Consulting in Dresden, Germany. He is member of IEE EPS and co-Editor of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Steffen has over 20 years' experience in the semiconductor industry and is the author or co-author of 23 patent filings.

作者簡介(中文翻譯)

Beth Keser, PhD, 是IEEE Fellow及傑出講師，擁有超過23年的半導體產業經驗，並且是嵌入式與扇出晶圓級封裝技術進展的共同編輯。Beth在為半導體設備開發革命性電子封裝方面的卓越表現，已獲得30項專利及專利申請，並在半導體產業發表超過50篇論文。

Steffen Kröhnert 是德國德累斯頓ESPAT-Consulting的總裁及創辦人。他是IEE EPS的成員，也是嵌入式與扇出晶圓級封裝技術進展的共同編輯。Steffen在半導體產業擁有超過20年的經驗，並且是23項專利申請的作者或共同作者。

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