Semiconductors: Integrated Circuit Design for Manufacturability (Devices, Circuits, and Systems)
Artur Balasinski
- 出版商: CRC
- 出版日期: 2017-10-12
- 售價: $3,280
- 貴賓價: 9.5 折 $3,116
- 語言: 英文
- 頁數: 248
- 裝訂: Paperback
- ISBN: 1138075418
- ISBN-13: 9781138075412
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相關分類:
半導體
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其他版本:
Semiconductors: Integrated Circuit Design for Manufacturability (Hardcover)
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商品描述
Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details.
Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples.
Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one
This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
商品描述(中文翻譯)
由於集成電路製造(ICM)和可製造性設計(DfM)的不斷演進,大多數有關該主題的書籍在出版之前就已經過時了。這就是為什麼這個領域需要一本將焦點從數字轉移到更大的經濟概念而不是技術細節上的參考資料。
《半導體:集成電路製造的設計》涵蓋了集成電路設計(ICD)的漸進演變,並提出了改善製造中ICD的投資回報(ROI)策略。大多數書籍都將焦點放在詳細的工程改進和其對設備功能的影響上,而這本書則提供了重要的歷史背景和路線圖等關鍵寶貴資訊,並通過實例加以說明。
本書呈現了實際的測試案例,以說明產品挑戰,檢視可能的解決策略,並展示如何選擇和實施正確的解決方案。
本書顯示了DfM是一個強大的通用工程概念,其潛力超越了通常應用於自動佈局增強的範疇,集中在接近校正和圖案密度上。本書探討了ICD的概念,並將其主要步驟分解為產品定義、設計、佈局和製造。作者避免了對技術、技巧或具體設備尺寸的冗長討論,同時避免了可能阻礙其他書籍的笨拙章節結構。結果是一個非常實用、系統化的呈現,簡化了現有的DfM方法,概述了一套清晰的標準,幫助讀者評估可靠性、功能性和產量。本書仔細考慮了ICD製造中涉及的經濟和技術權衡,並探討了物理、電氣和邏輯設計的技術,使設計師、製造商和研究人員能夠定義產品架構和研究計劃。