Testing of Interposer-Based 2.5D Integrated Circuits
Ran Wang, Krishnendu Chakrabarty
- 出版商: Springer
- 出版日期: 2017-03-29
- 售價: $4,410
- 貴賓價: 9.5 折 $4,190
- 語言: 英文
- 頁數: 182
- 裝訂: Hardcover
- ISBN: 3319547135
- ISBN-13: 9783319547138
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This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.