相關主題
商品描述
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
商品描述(中文翻譯)
透過矽通孔（Through Silicon Via, TSV）是實現三維集成電路（3D ICs）的關鍵技術，旨在未來高效能和低功耗的小型系統中應用。本書涵蓋了定性和定量的方法，提供了從信號完整性、電源完整性和熱完整性等多個角度對TSV建模的深入見解。本書中的大多數分析包括模擬、數值建模和驗證測量。每章的作者和共同作者在TSV領域深入研究多年，累積的技術知識和相關主題的技巧得到了全面的涵蓋。
